A short review of the electrochemical technologies for pit arrays fabricated on the surfaces of indium phosphide wafer

A short review of the electrochemical technologies for pit arrays fabricated on the surfaces of indium phosphide wafer

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Fabricating a pit array on the surface of indium phosphide wafer can change its photoelectric properties, improve its photoelectric conversion efficiency, and expand its application range.There are few reviews devoted to the fabrication of regular hole arrays on the surface of indium phosphide wafers by electrochemical methods.In this paper, Teapot twelve electrochemical approaches for assembling pit arrays on the surface of indium phosphide wafers were introduced, the structure and experimental process Bandana Top of the electrochemical device were highlighted, and the resulting top and section views were also shown by animation.It can provide a useful reference guide for the large-scale fabrication of regular hole arrays on the surface of indium phosphide wafers.